To Dear Editor or whom it may concern:

On behalf of my co-authors, I am submitting the attached manuscript online for possible publication in. It has not been submitted for publication nor has it been published in whole or in part elsewhere. I attest to the fact that all authors listed on the title page have read the manuscript, attest to the validity and legitimacy of the data and its interpretation, and agree to its submission to .

Allicin is an important compound extracted from garlic. However, the stability was not understood well because it takes at least 7-15 minutes with traditional HPLC methods to detect, the stability within a short time (shorter than 0.5 h) couldn’t be analyzed by HPLC. Hence, significance of the manuscript included: (1) in this study, using UPLC, the stability of allicin extracted in water extraction from garlic was detailedly evaluated. UPLC is much more effective than traditional HPLC which make it possible to understand the stability of allicin within 3 minutes; (2) the article reported the stability of allicin in temperature, phosphate buffer , pH value from 1.50 to 11.0 in detail. The results was more elaborate than that reported in previous study;

(3) it is the first time that the stability under light was evaluated in the article. So, we believed that the results in the study would benefit readers who were interested in the compound from garlic, like chemistry analyzer, pharmacy producer for instance.

Best wishes,

31 March 2014

 

第二篇：Cover Letter模板

求 职 信

尊敬的先生/小姐：

您好，我是上海交通大学电子信息学院自动化专业的应届硕士毕业生。基于对贵公司优良开发环境的了解和对自身扎实理论功底及丰富编程经验的自信，特向贵公司申请工作机会。随函附有我的简历及证明，兹列入下：

1． 个人简历 (中文)

2． 个人简历 (英文)

3． 研究生成绩单 (复印件, 中文)

4． 本科成绩单 (复印件,中文)

5． 研究生阶段排名及奖学金证明 (复印件, 英文/中文)

6． 本科阶段排名证明 (复印件, 英文/中文)

7． 本科阶段奖学金证明 (复印件, 英文)

感谢您的宝贵时间,希望有机会能与您面谈。

此致

李增中

Cover Letter

Dear Sir or Madam:

It’s my great pleasure to apply for a position in your reputed company.

I am a third year graduate student major in Automation at Shanghai Jiao Tong University. With solid theory foundation and rich project experience accumulated during the past academic years, I have the confidence that I qualify your recruitment condition. I hope we can come to an agreement based on our mutual interests after all. Now, I enclose my application materials as list blow:

1. Resume (Chinese)

2. Resume (English)

3. Graduate Transcript (Copy, Chinese)

4. Undergraduate Transcript (Copy, Chinese)

5. Certification of Rankings and Scholarships for graduate (Copy, English/Chinese)

6. Certification of Rankings for undergraduate (Copy, English/Chinese)

7. Certification of Scholarship for undergraduate (Copy, English)

Your detailed review will be very appreciated. Thank you very much.

Your Truly Zeng-Zhong Li

随函都为复印件，如需要正式件，请与我联系